The room-temperature curing epoxy resin system is mainly used for the encapsulation of low-voltage coils and the potting of components.It features a long pot life,ultra-low temperature resistance, and a smooth surface.
| Formula | Formula | Application Process | Application |
| HJ-6011A/HJ-6011B | Rapid curing at room temperature | Potting, Coating | Electronic Components and Composite Materials |
| HJ-6023A/HJ-6023B | Rapid curing at room temperature | Potting, Coating | Electronic Components |
| HJ-6028A/HJ-6028B | Rapid curing at room temperature, Surface smoothness | Potting, Coating | Electronic Components and Composite Materials |
| HJ-6031A/HJ-6031B | Outdoors, Room temperature curing, Surface smoothness | Potting, Coating | Electronic Components and Composite Materials |
| HJ-6216A/HE-6216B | Rapid curing at room temperature, Surface smoothness | Potting, Coating | Electronic Components and Composite Materials |
| HE-6872/HH-6872 | Room temperature curing, Can make the time long, High TG | Potting, Coating, Casting, Impregnation | Electronic Components and Composite Materials |
| HE-6873/HH-6873 | Room temperature curing, Can make the time long, Surface smoothness | Potting, Coating, Casting, Impregnation | Electronic Components and Composite Materials |
| HE-6897/HH-6897 | Room temperature curing, High TG | Potting, Coating, Casting, Impregnation | Electronic Components and Composite Materials |
| HE-852/HH-852 | Room temperature curing, Can make the time long, Surface smoothness | Potting, Coating, Casting, Impregnation | Electronic Components and Composite Materials |
| HW-6028/HH-6029 | Room temperature curing, Small temperature rise | Potting, Coating, Casting | Electronic Components and Composite Materials |
| HW-6068A/HE-6068B | B Room temperature curing, Resistant to ultra-low temperature, High temperature resistance | Potting, Coating, Casting | Electronic Components and Composite Materials |