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Electrical components

2025-09-11

The room-temperature curing epoxy resin system is mainly used for the encapsulation of low-voltage coils and the potting of components.It features a long pot life,ultra-low temperature resistance, and a smooth surface.

Formula Formula Application Process Application 
HJ-6011A/HJ-6011B Rapid curing at room temperature Potting, Coating Electronic Components and Composite Materials
HJ-6023A/HJ-6023B Rapid curing at room temperature Potting, Coating Electronic Components
HJ-6028A/HJ-6028B Rapid curing at room temperature, Surface smoothness Potting, Coating Electronic Components and Composite Materials
HJ-6031A/HJ-6031B Outdoors, Room temperature curing, Surface smoothness Potting, Coating Electronic Components and Composite Materials
HJ-6216A/HE-6216B Rapid curing at room temperature, Surface smoothness Potting, Coating Electronic Components and Composite Materials
HE-6872/HH-6872 Room temperature curing, Can make the time long, High TG Potting, Coating, Casting, Impregnation Electronic Components and Composite Materials
HE-6873/HH-6873 Room temperature curing, Can make the time long, Surface smoothness Potting, Coating, Casting, Impregnation Electronic Components and Composite Materials
HE-6897/HH-6897 Room temperature curing, High TG Potting, Coating, Casting, Impregnation Electronic Components and Composite Materials
HE-852/HH-852 Room temperature curing, Can make the time long, Surface smoothness Potting, Coating, Casting, Impregnation Electronic Components and Composite Materials
HW-6028/HH-6029 Room temperature curing, Small temperature rise Potting, Coating, Casting Electronic Components and Composite Materials
HW-6068A/HE-6068B B Room temperature curing, Resistant to ultra-low temperature, High temperature resistance Potting, Coating, Casting Electronic Components and Composite Materials